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CVE
PUBLISHED

CVE-2022-33307

Double free in Automotive

Assignerqualcomm
Reserved2022-06-14
Published2023-06-06
Updated2024-07-06

Description

Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed.



HIGH: 8.4CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H

Problem types

CWE-415 Double Free

Product status

Default status
unaffected

AQT1000
affected

FastConnect 6200
affected

FastConnect 6800
affected

FastConnect 6900
affected

FastConnect 7800
affected

QAM8255P
affected

QAM8295P
affected

QAM8650P
affected

QAM8775P
affected

QCA6174A
affected

QCA6310
affected

QCA6335
affected

QCA6391
affected

QCA6420
affected

QCA6421
affected

QCA6426
affected

QCA6430
affected

QCA6431
affected

QCA6436
affected

QCA6564A
affected

QCA6564AU
affected

QCA6574
affected

QCA6574A
affected

QCA6574AU
affected

QCA6595
affected

QCA6595AU
affected

QCA6696
affected

QCA6698AQ
affected

QCA6797AQ
affected

QCA9377
affected

QSM8350
affected

Robotics RB3 Platform
affected

SA6145P
affected

SA6150P
affected

SA6155
affected

SA6155P
affected

SA8145P
affected

SA8150P
affected

SA8155
affected

SA8155P
affected

SA8195P
affected

SA8255P
affected

SA8295P
affected

SA8540P
affected

SA9000P
affected

SD 675
affected

SD 8 Gen1 5G
affected

SD 8CX
affected

SD670
affected

SD675
affected

SD855
affected

SD865 5G
affected

SM7250P
affected

Snapdragon 670 Mobile Platform
affected

Snapdragon 675 Mobile Platform
affected

Snapdragon 678 Mobile Platform (SM6150-AC)
affected

Snapdragon 765 5G Mobile Platform (SM7250-AA)
affected

Snapdragon 765G 5G Mobile Platform (SM7250-AB)
affected

Snapdragon 768G 5G Mobile Platform (SM7250-AC)
affected

Snapdragon 8 Gen 1 Mobile Platform
affected

Snapdragon 845 Mobile Platform
affected

Snapdragon 850 Mobile Compute Platform
affected

Snapdragon 855 Mobile Platform
affected

Snapdragon 855+/860 Mobile Platform (SM8150-AC)
affected

Snapdragon 865 5G Mobile Platform
affected

Snapdragon 865+ 5G Mobile Platform (SM8250-AB)
affected

Snapdragon 870 5G Mobile Platform (SM8250-AC)
affected

Snapdragon 888 5G Mobile Platform
affected

Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
affected

Snapdragon 8c Compute Platform (SC8180X-AD) "Poipu Lite"
affected

Snapdragon 8c Compute Platform (SC8180XP-AD) "Poipu Lite"
affected

Snapdragon 8cx Compute Platform (SC8180X-AA, AB)
affected

Snapdragon 8cx Compute Platform (SC8180XP-AC, AF) "Poipu Pro"
affected

Snapdragon 8cx Gen 2 5G Compute Platform (SC8180X-AC, AF) "Poipu Pro"
affected

Snapdragon 8cx Gen 2 5G Compute Platform (SC8180XP-AA, AB)
affected

Snapdragon 8cx Gen 3 Compute Platform (SC8280XP-AB, BB)
affected

Snapdragon AR2 Gen 1 Platform
affected

Snapdragon X24 LTE Modem
affected

Snapdragon X50 5G Modem-RF System
affected

Snapdragon X55 5G Modem-RF System
affected

Snapdragon XR2 5G Platform
affected

SSG2115P
affected

SSG2125P
affected

SXR1230P
affected

SXR2130
affected

Vision Intelligence 300 Platform
affected

Vision Intelligence 400 Platform
affected

WCD9326
affected

WCD9340
affected

WCD9341
affected

WCD9370
affected

WCD9375
affected

WCD9380
affected

WCD9385
affected

WCN3950
affected

WCN3980
affected

WCN3990
affected

WSA8810
affected

WSA8815
affected

WSA8830
affected

WSA8832
affected

WSA8835
affected

References

https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin

cve.org CVE-2022-33307

nvd.nist.gov CVE-2022-33307

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